A compact three-dimensional (3D) chipless radiofrequency identification (RFID) tag realized by using additive manufacturing processes is presented. This novel class of chipless RFID tags exploits high dielectric permittivity materials and the flexibility offered by the fused filament fabrication (FFF) to encode the information into the spectral fingerprint of the 3D tag. A dedicated encoding algorithm maximizes the available identification sequences on the basis of the expected level of accuracy provided by the employed technology and reading scheme.
3D Printed Chipless Tag based on spectral encoding scheme
Terranova S.;Costa F.;Manara G.;Genovesi S.
2021-01-01
Abstract
A compact three-dimensional (3D) chipless radiofrequency identification (RFID) tag realized by using additive manufacturing processes is presented. This novel class of chipless RFID tags exploits high dielectric permittivity materials and the flexibility offered by the fused filament fabrication (FFF) to encode the information into the spectral fingerprint of the 3D tag. A dedicated encoding algorithm maximizes the available identification sequences on the basis of the expected level of accuracy provided by the employed technology and reading scheme.File in questo prodotto:
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