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EnglishAn original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.
| Titolo: | An Integrated Circuit Compatible Compact Package For Thermal Gas Flowmeters | |
| Autori interni: | ||
| Anno del prodotto: | 2007 | |
| Abstract: | An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described. | |
| Handle: | http://hdl.handle.net/11568/117744 | |
| ISBN: | 9782355000003 | |
| Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |
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