An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.

An Integrated Circuit Compatible Compact Package For Thermal Gas Flowmeters

BRUSCHI, PAOLO;PIOTTO, MASSIMO
2007-01-01

Abstract

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.
2007
9782355000003
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11568/117744
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