A preliminary investigation of the possibility to exploit three-dimensional (3D) printing technology for the fabrication of a transmitarray (TA) is addressed. More in detail, both dielectric and metallic unit cells are designed with the purpose of providing a non-uniform phase profile of the TA panel to collimate the main beam at broadside direction (θ=0°).
Low Profile 3-D Printed Transmitarray for Future 6G Wireless Communications
Dicandia F. A.;Genovesi S.
2023-01-01
Abstract
A preliminary investigation of the possibility to exploit three-dimensional (3D) printing technology for the fabrication of a transmitarray (TA) is addressed. More in detail, both dielectric and metallic unit cells are designed with the purpose of providing a non-uniform phase profile of the TA panel to collimate the main beam at broadside direction (θ=0°).File in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
