Is it feasible to fabricate advanced silicon microstructures and microsystems for (bio)sensing applications in any lab, at low cost, and with high flexibility? In this tutorial it is shown that silicon microstructures and microsystems of high complexity for (although not limited to) (bio)sensing applications can be effectively fabricated in any research lab with sub-micrometer accuracy and high aspect ratio values (about 100), which is well beyond any up-to-date wet or dry microstructuring approach, using a wet etching, low-cost technology, namely silicon electrochemical micromachining (ECM).

ADVANCED SILICON MICROSTRUCTURING IN ANY LAB FOR (BIO)SENSING APPLICATIONS: THE CASE OF THE ELECTROCHEMICAL MICROMACHINING TECHNOLOGY

BARILLARO, GIUSEPPE
2014-01-01

Abstract

Is it feasible to fabricate advanced silicon microstructures and microsystems for (bio)sensing applications in any lab, at low cost, and with high flexibility? In this tutorial it is shown that silicon microstructures and microsystems of high complexity for (although not limited to) (bio)sensing applications can be effectively fabricated in any research lab with sub-micrometer accuracy and high aspect ratio values (about 100), which is well beyond any up-to-date wet or dry microstructuring approach, using a wet etching, low-cost technology, namely silicon electrochemical micromachining (ECM).
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11568/782805
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