A new integrated sensor for the acoustic particle velocity measurement is proposed. The device is based on a thermal principle and is made up of two polysilicon heaters placed over suspended dielectric membranes. The sensor is fabricated by means of a post-processing technique applied to chips designed with a commercial CMOS process. Preliminary measurements confirm the device suitability for acoustic applications. © 2012 Springer Science+Business Media, LLC.
|Titolo:||Acoustic particle velocity sensors based on a thermal principle|
|Anno del prodotto:||2012|
|Appare nelle tipologie:||4.1 Contributo in Atti di convegno|