The PixFEL project is conceived as the first stage of a long term research program aiming at the development of advanced instrumentation for coherent X-ray diffractive imaging applications at the next generation free electron laser (FEL) facilities. The project aims at substantially advancing the state-of-the-art in the field of 2D X-ray imaging through the adoption of cutting-edge microelectronic technologies and innovative design and architectural solutions. For this purpose, the collaboration is developing the fundamental microelectronic building blocks (low noise analog front-end with dynamic compression feature, high resolution, low power ADC, high density memories) and investigating and implementing the enabling technologies (active edge pixel sensors, high density and low density through silicon vias) for the assembly of a multilayer four side buttable tile. The building block design is being carried out in a 65 nm CMOS technology. The ambitious goal of the research program is the fabrication of an X-ray camera with single photon resolution, 1 to 104 photons @ 1 keV to 10 keV input dynamic range, 1 kevent in-pixel memory, 100 μm pixel pitch, and the capability to be operated at the fast (1 MHz or larger) rates foreseen for the future X-ray FEL machines.
PixFEL: Enabling technologies, building blocks and architectures for advanced X-ray pixel cameras at the next generation FELs
BATIGNANI, GIOVANNI;BETTARINI, STEFANO;CASAROSA, GIULIA;FORTI, FRANCESCO;MORSANI, FABIO;PALADINO, ANTONIO;PAOLONI, EUGENIO;RIZZO, GIULIANA;
2014-01-01
Abstract
The PixFEL project is conceived as the first stage of a long term research program aiming at the development of advanced instrumentation for coherent X-ray diffractive imaging applications at the next generation free electron laser (FEL) facilities. The project aims at substantially advancing the state-of-the-art in the field of 2D X-ray imaging through the adoption of cutting-edge microelectronic technologies and innovative design and architectural solutions. For this purpose, the collaboration is developing the fundamental microelectronic building blocks (low noise analog front-end with dynamic compression feature, high resolution, low power ADC, high density memories) and investigating and implementing the enabling technologies (active edge pixel sensors, high density and low density through silicon vias) for the assembly of a multilayer four side buttable tile. The building block design is being carried out in a 65 nm CMOS technology. The ambitious goal of the research program is the fabrication of an X-ray camera with single photon resolution, 1 to 104 photons @ 1 keV to 10 keV input dynamic range, 1 kevent in-pixel memory, 100 μm pixel pitch, and the capability to be operated at the fast (1 MHz or larger) rates foreseen for the future X-ray FEL machines.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.