Low-frequency noise (LFN) measurements are often applied to the characterization of electron devices. When such mea- surements have to be performed on electronic components main- tained at a given temperature, the thermal stability of the oven which is used for this purpose becomes a major concern, because of the high sensitivity of electron devices to temperature fluctuations (TF’s). In this paper, we present the realization of a high-stability tem- perature-controlled oven, purposely designed for the characteri- zation of electromigration in metal interconnections of integrated circuits by means of low-frequency noise measurements. The prototype which has been realized demonstrates that the contribution of the thermal fluctuations of the oven to the back- ground noise of the measurement system is negligible down to fre- quencies as low as 10 mHz in the entire range of operating temper- atures (25–250 C).
|Autori interni:||DI PASCOLI, STEFANO|
|Autori:||CIOFI C.; CIOFI I.; DI PASCOLI S; NERI B.|
|Titolo:||Temperature Controlled Oven for low noise measurements systems|
|Anno del prodotto:||2000|
|Digital Object Identifier (DOI):||10.1109/19.850392|
|Appare nelle tipologie:||1.1 Articolo in rivista|