Silicon suspended wires with a cross section of about 0.25 mm have been fabricated by means of a simple process, starting from a SOI n-type wafer. Standard lithography, isotropic and anisotropic etchings were used. The process requires only two masks with a minimum dimension of 4 mm. After the definition of the suspended structures a further oxidation step was performed in order to reduce the silicon core dimensions. Particular care was devoted to the rinsing step to avoid any sticking problem to the substrate.

Micromachined silicon suspended wireswith submicrometric dimensions

BRUSCHI, PAOLO;DILIGENTI, ALESSANDRO;PIOTTO, MASSIMO
2001-01-01

Abstract

Silicon suspended wires with a cross section of about 0.25 mm have been fabricated by means of a simple process, starting from a SOI n-type wafer. Standard lithography, isotropic and anisotropic etchings were used. The process requires only two masks with a minimum dimension of 4 mm. After the definition of the suspended structures a further oxidation step was performed in order to reduce the silicon core dimensions. Particular care was devoted to the rinsing step to avoid any sticking problem to the substrate.
2001
Bruschi, Paolo; Diligenti, Alessandro; Piotto, Massimo
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11568/185368
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