This paper presents a steady-state thermal simulation strategy called DJOSER, which is dedicated primarily but not exclusively to packaging structures for electronic devices. It is applicable to structures that can be likened to a set of homogeneous layers stacked one on top of the other and possibly separated by thermal contact resistances, where the dissipated powers are due to two-dimensional heat sources distributed on the interfaces between the layers. A broad range of contour conditions and types of dissipated powers is included to make the models as close as possible to the typical structures of modern assembly technologies. Flow and temperature distributions are obtained via a system of integral equations that can be translated directly, with the usual squaring techniques, into a linear algebraic system.

DJOSER: ANALYTICAL THERMAL SIMULATOR FOR MULTILAYER ELECTRONIC STRUCTURES. THEORY AND NUMERICAL IMPLEMENTATION,

BAGNOLI, PAOLO EMILIO;CASAROSA, CLAUDIO;STEFANI F.
2007

Abstract

This paper presents a steady-state thermal simulation strategy called DJOSER, which is dedicated primarily but not exclusively to packaging structures for electronic devices. It is applicable to structures that can be likened to a set of homogeneous layers stacked one on top of the other and possibly separated by thermal contact resistances, where the dissipated powers are due to two-dimensional heat sources distributed on the interfaces between the layers. A broad range of contour conditions and types of dissipated powers is included to make the models as close as possible to the typical structures of modern assembly technologies. Flow and temperature distributions are obtained via a system of integral equations that can be translated directly, with the usual squaring techniques, into a linear algebraic system.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11568/202155
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