A simplified model is presented for the degradation of the conducting properties of Al stripes subjected to electromigration. Such a model has been used in order to investigate the role of grain boundaries in the be- havior of the temperature coefficient of resistance (TCR). The results obtained by means of two dimensional simulations allow us to give a sim- ple interpretation of the experimentallyobserved fluctuations of the TCR during electromigration.
|Autori:||CIOFI C.; DI PASCOLI S|
|Titolo:||Temperature coefficient of resistance fluctuations during electromigration in Al lines|
|Anno del prodotto:||1997|
|Digital Object Identifier (DOI):||10.1016/0026-2714(96)00240-5|
|Appare nelle tipologie:||1.1 Articolo in rivista|