A simplified model is presented for the degradation of the conducting properties of Al stripes subjected to electromigration. Such a model has been used in order to investigate the role of grain boundaries in the be- havior of the temperature coefficient of resistance (TCR). The results obtained by means of two dimensional simulations allow us to give a sim- ple interpretation of the experimentallyobserved fluctuations of the TCR during electromigration.

Temperature coefficient of resistance fluctuations during electromigration in Al lines

DI PASCOLI, STEFANO
1997

Abstract

A simplified model is presented for the degradation of the conducting properties of Al stripes subjected to electromigration. Such a model has been used in order to investigate the role of grain boundaries in the be- havior of the temperature coefficient of resistance (TCR). The results obtained by means of two dimensional simulations allow us to give a sim- ple interpretation of the experimentallyobserved fluctuations of the TCR during electromigration.
Ciofi, C.; DI PASCOLI, Stefano
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11568/44878
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