We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with both 3D and planar active-edge pixel sensors to be made on 6" p-type wafers. The technology and the design will be optimized and qualified for extreme radiation hardness (2×1016 neq cm-2). Pixel layouts compatible with present (for testing) and future (RD53 65nm) front-end chips of ATLAS and CMS are considered. The paper covers the main aspects of the research program, from the sensor design and fabrication technology, to the results of initial tests performed on the first prototypes. © 2015 Elsevier B.V.

The INFN-FBK "Phase-2" R&D program

MESSINEO, ALBERTO MARIA;
2015-01-01

Abstract

We report on the 3-year INFN ATLAS-CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 upgrades. The program is concerned with both 3D and planar active-edge pixel sensors to be made on 6" p-type wafers. The technology and the design will be optimized and qualified for extreme radiation hardness (2×1016 neq cm-2). Pixel layouts compatible with present (for testing) and future (RD53 65nm) front-end chips of ATLAS and CMS are considered. The paper covers the main aspects of the research program, from the sensor design and fabrication technology, to the results of initial tests performed on the first prototypes. © 2015 Elsevier B.V.
2015
G. F., Dalla Betta; M., Boscardin; M., Bomben; M., Brianzi; G., Calderini; G., Darbo; R., Dell’Orso; A., Gaudiello; G., Giacomini; R., Mendicino; M., Meschini; Messineo, ALBERTO MARIA; S., Ronchin; D. M. S., Sultan; N., Zorzi
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11568/779296
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