System-level specifications for the design of integrated power amplifiers in mmWave wireless communications are derived in the paper. To this aim emerging standards for consumer applications such as wireless ultra-high definition (UHD) multimedia streaming or Gbit wireless LAN are considered (WirelessHD, WiGig, ECMA387, IEEE.802.11.ad, IEEE802.15.3c and upcoming 5G). A power amplifier design in 65 nm CMOS Silicon on Insulator (SOI) technology, targeting a 9 GHz UWB window from 57 to 66 GHz, is also proposed. To increase the power delivered to the antenna up to 18 mW, being still in the limit of maximum 1 dB compression point, multiple PA cores have been combined through a Wilkinson power combiner, but other solutions can be also explored for a better power efficiency and linearity.

System-Level Analysis for Integrated Power Amplifier Design in mmWave Consumer Wireless Communications

SAPONARA, SERGIO
Primo
Writing – Original Draft Preparation
;
NERI, BRUNO
2017-01-01

Abstract

System-level specifications for the design of integrated power amplifiers in mmWave wireless communications are derived in the paper. To this aim emerging standards for consumer applications such as wireless ultra-high definition (UHD) multimedia streaming or Gbit wireless LAN are considered (WirelessHD, WiGig, ECMA387, IEEE.802.11.ad, IEEE802.15.3c and upcoming 5G). A power amplifier design in 65 nm CMOS Silicon on Insulator (SOI) technology, targeting a 9 GHz UWB window from 57 to 66 GHz, is also proposed. To increase the power delivered to the antenna up to 18 mW, being still in the limit of maximum 1 dB compression point, multiple PA cores have been combined through a Wilkinson power combiner, but other solutions can be also explored for a better power efficiency and linearity.
2017
Saponara, Sergio; Neri, Bruno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11568/811469
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