A novel method to electrically insulate integrated thermal flow sensors from liquids is proposed. The sensor is fabricated with a post-processing technique applied to chips designed with a commercial CMOS process. A low cost packaging technique is used to convey the liquid to the sensing structures. After packaging, a simple technique is used to coat the flow channel and the chip area exposed to the fluid with silicone. Preliminary tests in water confirm the effectiveness of the proposed method.

An integrated thermal flow sensor for liquids based on a novel technique for electrical insulation

PIOTTO, MASSIMO;DI PANCRAZIO, ALESSIA;INTASCHI, LUCA;BRUSCHI, PAOLO
2015

Abstract

A novel method to electrically insulate integrated thermal flow sensors from liquids is proposed. The sensor is fabricated with a post-processing technique applied to chips designed with a commercial CMOS process. A low cost packaging technique is used to convey the liquid to the sensing structures. After packaging, a simple technique is used to coat the flow channel and the chip area exposed to the fluid with silicone. Preliminary tests in water confirm the effectiveness of the proposed method.
9783319096162
978-3-319-09617-9
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11568/813682
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