The paper analyses the trend in packaging for low-power integrated circuits (IC) and the principal failures that can occur. A Fault-tree (FT) analysis is proposed, as well an analysis of the failure distribution (FD), which can be useful in safety-critical applications such as industrial and automotive.
Failure Analysis of Plastic Packages for Low-Power Integrated Circuits
SAPONARA, SERGIO
Primo
Writing – Review & Editing
;CIARPI, GABRIELEWriting – Review & Editing
;FANUCCI, LUCAWriting – Review & Editing
2017-01-01
Abstract
The paper analyses the trend in packaging for low-power integrated circuits (IC) and the principal failures that can occur. A Fault-tree (FT) analysis is proposed, as well an analysis of the failure distribution (FD), which can be useful in safety-critical applications such as industrial and automotive.File in questo prodotto:
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LNEE2017_Saponara_Ciarpi_Fanucci.pdf
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