Traditional [Median time to Failure (MTF)] and non traditional (Noise measurements) techniques have been used to characterize four types of Al based samples. Relatively weak stress conditions, which cause negligible modifications to the sample structure, have been used for noise measurements, whereas more accelerated stress conditions have been used for lifetime tests. Quite different results have been obtained by the two types of characterization. In fact, the experimental data showed that the noise measurements are useful to evaluate the activation energy at relatively weak stress conditions, but cannot be used to foresee the behavior of the samples at strongly accelerated stress conditions. This is particularly true in the case of samples containing copper which probably undergo significant microstructural modifications as the temperature goes up. Moreover, the results of a simple computer simulation which show the dramatic effect on the Time to Failure of the spreading of the values of the thermal resistance of the samples are reported. Copyright (C) 1996 Elsevier Science Ltd.
Electromigration in Al based stripes: Low frequency noise measurements and MTF tests
BAGNOLI, PAOLO EMILIO;NERI, BRUNO;PENNELLI, GIOVANNI
1996-01-01
Abstract
Traditional [Median time to Failure (MTF)] and non traditional (Noise measurements) techniques have been used to characterize four types of Al based samples. Relatively weak stress conditions, which cause negligible modifications to the sample structure, have been used for noise measurements, whereas more accelerated stress conditions have been used for lifetime tests. Quite different results have been obtained by the two types of characterization. In fact, the experimental data showed that the noise measurements are useful to evaluate the activation energy at relatively weak stress conditions, but cannot be used to foresee the behavior of the samples at strongly accelerated stress conditions. This is particularly true in the case of samples containing copper which probably undergo significant microstructural modifications as the temperature goes up. Moreover, the results of a simple computer simulation which show the dramatic effect on the Time to Failure of the spreading of the values of the thermal resistance of the samples are reported. Copyright (C) 1996 Elsevier Science Ltd.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
