Characterization and modeling of CMOS-compatible acoustical particle velocity sensors for applications requiring low supply voltages

Acoustic particle velocity sensors have been obtained applying simple low resolution micromachining steps to chips fabricated using a standard microelectronic process. Each sensor consists of four silicided polysilicon wires, suspended over cavities etched into the substrate, and connected to form a heatstone bridge. Full compatibility of the micromachining procedure with the original process is demonstrated by integrating a simple pre-amplifier on the same chip as the sensors and showing that both blocks are functional. Proper design of the sensing structures allows them to operate with a single 3.3 V power supply. Sensitivity and noise measurements, performed to estimate the sensor detection limit, are described. Excess noise with a flicker-like behavior, not ascribable to the amplifier, is found when the bridges are biased in working conditions. In addition, the dependence of the sensitivity on the dc bias voltage of the bridges is investigated, comparing the experimental data with the results of a simple analytical model and finite element method simulations.